Market Trends For LED Display Raw Materials（2026）

一.LED driver ICs（the biggest cost pain point this year）

Mainstream manufacturer: ICN/FM/SM/DP

（1）Price increase:

①General purpose constant current ICs（outdoor large screens, low end rental market）+15% to 25% year on year.

②Common cathode ICs, high refresh rate ICs, and fine pitch specific ICs: cumulative price increase of 25% to 33% in May, ICN officially raised prices across its entire product line by over 30%.

③Spot market models command a significant premium, whereas prices for long term contract orders remain relatively stable.

（2）Lead time:

①Standard components 6 to 8 weeks, scarce fine pitch/common cathode components 8 to 12 weeks, with some models currently out of stock.

（3）The root cause of the price hike:

①Production capacity for mature 8 inch wafers is being heavily consumed by power chips for AI servers, foundry prices continue to rise, manufacturers prioritize major clients with long term contracts, while small and medium sized panel makers are forced to accept high prices for spot market purchases.

（4）Outlook for the second half of the year:

①A significant pullback is unlikely, spot prices are prone to surging again during the peak season, overseas stocking from September to November, it’s recommended to lock in prices for key models through quarterly long term contracts.

二.LED chips & SMD/COB lamp

（1）RGB display chip:

①Outdoor general purpose chips for larger pixel pitches （P3/P4/P5 and above）Supply and demand are balanced, prices are seeing a moderate increase of +5% to 10%.

②Mini RGB and flip chip（fine pitch P1.8 and below, COB）Tight supply demand balance +12% to 22%, leading packaging manufacturers are securing capacity first.

③Red/yellow led chips: shortage of raw material indium, prices continue to strengthen.

（2）Packaged LED lamp（1515, 2020, 2727, 3535 outdoor）:

①Skyrocketing silver paste prices, silver prices have risen sharply year on year, silver paste accounts for over 30% of packaging costs.

②Standard SMD LED lamp 6% to 14% year on year increase.

③COB flip chip leds tight production capacity and persistent price premiums.

三.PCB & CCL（second largest cost pressure for modules）

①Cumulative increase of 40% to 55% for the year to date.

②Prices of electronic grade fiberglass cloth and copper foil are rising in tandem, high AI circuit board continue to snap up thin copper foil production capacity.

③Standard P C B s for LED displays（single/double sides）18% to 25% year on year increase.

④Prices for high precision, fine pitch P C B s featuring thick copper and impedance requirements have risen by nearly 30%.

四.Non ferrous metals（housing, welding materials, thermal conductive materials）

（1）Copper（Electrolytic Copper）:

①Copper prices remain at a high level of 105,00 to 107,000 RMB/tonne, up more than 30% year on year.

Impact: cost of PCB copper foil, power cables, and copper heat dissipation materials continue to rise.

（2）Aluminum Ingots（Die cast aluminum housing, aluminum profiles）:

①Aluminum prices fluctuated within the 23,000 to 23,800 RMB/tonne range, up approximately 18% year on year.

Direct impact: costs for 640 x 480 and 960 x 960 die cast aluminum cabinets and frames, cabinet processing fees increased by 5% to 12%.

（3）Tin metal（solder, solder paste）:

①Spot prices continue to hit new lights, with year on year gains exceeding 40%.

Risk factor: Tin ore supply is tightening should prices continue to rise, the cost of welding consumables will increase further.

五.Power supply components & LED switching power supplies

①There’s significant differentiation among MOSFETs, power management ICs, and electrolytic capacitors.

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