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Why GOB Process Chosen For Fine Pitch Led

1)The core advantages of the GOB process: ①The GOB process involves encapsulating the surface of the led module, after the led chips have been soldered, with a layer of special transparent optical adhesive. ②Significantly enhanced physical protection: the formed colloidal layer effectively provides waterproofing, moisture resistance, dust protection, and impact resistance. ③This allows the screen

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