GOB 화면의 특징

GOB packaging technology is essentially SMD technology, but it reinforces and strengthens the SMD screen.

A layer of special transparent epoxy resin is evenly applied to the surface of the assembled SMD module. After curing, this adhesive forms a high-hardness, high-transmittance protective layer that encapsulates all the LEDs, solder joints, and leads, creating a protective shield.

The features (advantages) of a GOB screen are as follows:

（1）Superior Protection

—Impact and Shock Resistance: The rigid gel layer effectively withstands external impacts, scratches, and vibrations.

In scenarios prone to physical collisions—such as rentals, stage performances, and high-traffic public spaces—it significantly reduces the risk of LED lamp damage.

—Moisture and Dust Resistance: The gel encapsulation seals all gaps between LED chips, effectively blocking moisture, dust, salt spray, and sulfide intrusion.

This enhances display stability in harsh environments and extends overall lifespan.

(2) High Reliability and Stability

—By covering the LED chips with protective adhesive, the solder joints between the LED chips and the PCB board are reinforced, reducing problems such as cold solder joints and LED failures caused by thermal      expansion and contraction and vibration.

—The overall failure rate is significantly reduced, making it particularly suitable for applications requiring long-term uninterrupted operation.

(3) Improved Heat Dissipation

—Dedicated thermally conductive adhesive can more evenly conduct and disperse the heat generated by the LED chip during operation, preventing localized heat accumulation.

This helps reduce the operating temperature of the LED chip and slows down light decay.

(4) Smooth Surface, Improved Visual Experience

—By filling the gaps between the LEDs, the display surface becomes a seamless plane, reducing graininess.

—The smooth surface helps reduce reflections, making viewing more comfortable and suppressing moiré patterns to some extent.

(5) High Cost-Effectiveness

—Compared to COB, which requires rebuilding a completely new production line, GOB adds a process to an existing, mature SMD production line, resulting in lower technical upgrade costs.

This allows it to maintain a very competitive price while improving reliability.

 

However, we also need to be aware of the drawbacks of GOB screens.

1）GOB  screen only provides external reinforcement, which cannot address the inherent physical structural defects of SMD LED lamps (such as brackets and gold wires, which remain potential points of failure).

2) Potential Adhesive Quality Issues

—If substandard adhesive is used or the curing process is inadequate, the adhesive layer may yellow over time, affecting display color and brightness.

—If the adhesive layer’s light transmittance is insufficient, it will cause light loss, requiring higher initial brightness from the LED chips to compensate.

3) High Repair Difficulty

This is GOB’s most significant drawback. If a single LED chip fails, repair requires using tools like a heat gun to locally heat the area and carefully remove the hardened adhesive before replacement.

The process is extremely complex, demands high technical skill, and is highly likely to damage surrounding healthy LED chips. Repair efficiency and success rate are lower than traditional SMD.