Why GOB Process Chosen For Fine Pitch Led

1）The core advantages of the GOB process：

①The GOB process involves encapsulating the surface of the led module, after the led chips have been soldered, with a layer of special transparent optical adhesive.

②Significantly enhanced physical protection: the formed colloidal layer effectively provides waterproofing, moisture resistance, dust protection, and impact resistance.

③This allows the screen to adapt to more complex environments and significantly reduces the risk of led beads falling off or being damaged due to bumps during installation, transportation, or daily use.

④Improved display performance: the colloidal layer can merge the originally independent point light sources into an effect closer to a surface light source, which helps improve light uniformity, increase the viewing angle, and can, to some extent, reduce moire pattern interference that may occur during image capture.

⑤Simplified cleaning and maintenance: the smooth, seamless surface created by the coating is easy to clean, preventing dust and water stains from accumulating, thus reducing the difficulty of long term maintenance.

2）The key difference from the COB process：

①The technologies are fundamentally different: GOB is an enhancement of the traditional SMD process, adding a protective layer to the soldered led chips. COB on the other hand, represents a technological innovation, it bypasses the led chip packaging step, directly fixing and encapsulating the light emitting chips dies onto the PCB board. Therefore, its structure is simpler and its integration level is higher.

②GOB is primarily used to improve the reliability and environmental adaptability of conventional and fine pitch led displays, as shown in the image above, it is ideal for scenarios with complex environments, potential physical contact, and where cost-effectiveness is a key consideration.

③COB technology is primarily used in applications requiring ultra fine pixel pitch, such as P1.2 and below and ultra high definition displays, this is because its structure inherently allows for a denser pixel arrangement, and it generally performs better in terms of reliability and visual uniformity.

④Different maintenance methods: when a single led fails in a GOB screen, it can theoretically still be repaired, however, the led lamps in a COB screen are directly integrated, so if damaged, the entire module usually needs to be replaced.

3）The significance of Fine Pitch using GOB:

①It effectively protects against impacts, vibrations, and scratches, accidental contact with the screen during installation, transportation, or cleaning will no longer easily cause led beads to detach or be damaged.

②Encapsulation adhesives protect solder joints and circuits, reducing problems such as poor soldering and cracking caused by temperature changes and stress, thereby improving the long term stability of the product.

③The colloidal material fills the gaps between the led beads, merging the originally separate point light sources into an effect closer to a surface light source, this results in a more uniform and softer image, providing greater viewing comfort at close range.

④The surface is smooth and flat, making it resistant to dust and fingerprints, and easy to clean with a soft cloth, greatly simplifying daily maintenance.

⑤Comprehensive protection effectively mitigates light degradation and malfunctions caused by environmental erosion and physical damage, thereby extending the overall lifespan of the display screen and reducing the total cost of ownership.