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GOB packaging technology is essentially SMD technology, but it reinforces and strengthens the SMD screen. A layer of special transparent epoxy resin is evenly applied to the surface of the assembled SMD module. After curing, this adhesive forms a high-hardness, high-transmittance protective layer that encapsulates all the LEDs, solder joints, and leads, creating a protective […]

COB 屏幕采用的封装技术不同于传统的 SMD 屏幕。SMD 屏幕封装工艺：这包括将 LED 芯片固定在支架杯内，封装成单个 LED 灯珠，然后将灯珠焊接到 PCB 板上。表面有颗粒状纹理；每个 LED 灯都是独立的，并且

The “scan” of an LED display refers to the ability of the driver IC to light up the number of rows per unit time, which is directly related to the brightness, refresh rate, stability, power consumption, and production cost of the display screen. Within the same time period, the screen is divided into 32 or