1)The features of  front maintenance led displays: ①Maintenance can be performed from the front of the screen, eliminating the need for a rear service channel. ②The housing or module can be fixed and removed from the front using magnetic adsorption, snap fit ​​structure, or special tools such as suction cups or front maintenance tools. ③Space […]

GOB packaging technology is essentially SMD technology, but it reinforces and strengthens the SMD screen. A layer of special transparent epoxy resin is evenly applied to the surface of the assembled SMD module. After curing, this adhesive forms a high-hardness, high-transmittance protective layer that encapsulates all the LEDs, solder joints, and leads, creating a protective

The packaging technology used in COB screens is different from that of traditional SMD screens. SMD screen packaging process: this involves fixing LED chips inside a bracket cup, encapsulating them into individual LED beads, and then soldering the beads onto a PCB board. The surface has a grainy texture; each LED lamp is separate and