{"id":18674,"date":"2026-07-31T05:50:44","date_gmt":"2026-07-31T05:50:44","guid":{"rendered":"https:\/\/cob-leddisplay.com\/?p=18674"},"modified":"2026-08-06T02:35:44","modified_gmt":"2026-08-06T02:35:44","slug":"market-trends-for-led-display-raw-materials%ef%bc%882026%ef%bc%89","status":"publish","type":"post","link":"https:\/\/cob-leddisplay.com\/pt\/market-trends-for-led-display-raw-materials%ef%bc%882026%ef%bc%89\/","title":{"rendered":"Tend\u00eancias de mercado para mat\u00e9rias-primas de displays de LED (2026)"},"content":{"rendered":"
I. Circuitos integrados de drivers de LED (o maior problema de custo deste ano)<\/span><\/h6>\n
Fabricante principal: ICN\/FM\/SM\/DP<\/h6>\n
(1) Aumento de pre\u00e7o:<\/h6>\n

\u2460 CIs de corrente constante de uso geralgrandes telas de LED externas<\/a>, mercado de aluguel de baixo custo) +15% para 25% ano a ano.<\/em><\/p>\n

\u2461 CIs de c\u00e1todo comum, CIs de alta taxa de atualiza\u00e7\u00e3o e CIs espec\u00edficos de passo fino: aumento cumulativo de pre\u00e7o de 25% a 33% em maio; a ICN aumentou oficialmente os pre\u00e7os em toda a sua linha de produtos em mais de 30%.<\/em><\/p>\n

\u2462Os modelos de mercado \u00e0 vista apresentam um pr\u00eamio significativo, enquanto os pre\u00e7os para pedidos de contratos de longo prazo permanecem relativamente est\u00e1veis.<\/em><\/p>\n

(2) Prazo de entrega:<\/h6>\n

\u2460 Componentes padr\u00e3o: 6 a 8 semanas; componentes de passo fino\/c\u00e1todo comum (em menor quantidade): 8 a 12 semanas; alguns modelos est\u00e3o atualmente fora de estoque.<\/em><\/p>\n

(3) A causa principal do aumento de pre\u00e7os:<\/h6>\n

\u2460A capacidade de produ\u00e7\u00e3o de wafers de 8 polegadas est\u00e1 sendo fortemente consumida por chips de alta pot\u00eancia para servidores de IA, os pre\u00e7os das fundi\u00e7\u00f5es continuam a subir, os fabricantes priorizam grandes clientes com contratos de longo prazo, enquanto os fabricantes de pain\u00e9is de pequeno e m\u00e9dio porte s\u00e3o for\u00e7ados a aceitar pre\u00e7os altos para compras no mercado \u00e0 vista.<\/em><\/p>\n

(4) Perspectivas para o segundo semestre do ano:<\/h6>\n

\u2460\u00c9 improv\u00e1vel uma corre\u00e7\u00e3o significativa, os pre\u00e7os \u00e0 vista tendem a subir novamente durante a alta temporada, com estoques no exterior de setembro a novembro. Recomenda-se garantir os pre\u00e7os dos modelos principais por meio de contratos trimestrais de longo prazo.<\/em><\/p>\n

\"\"<\/p>\n

II. Chips de LED e l\u00e2mpadas SMD\/COB<\/span><\/h6>\n
(1) Chip de tela RGB:<\/h6>\n

\u2460 Chips de uso geral para exteriores com espa\u00e7amento de pixels maior (P3\/P4\/P5 e superior): a oferta e a procura est\u00e3o equilibradas, os pre\u00e7os est\u00e3o a registar um aumento moderado de +5% para 10%.<\/em><\/p>\n

\u2461Mini RGB e flip chip (passo fino P1.8 e inferior, COB) Equil\u00edbrio apertado entre oferta e demanda +12% para 22%, os principais fabricantes de embalagens est\u00e3o garantindo capacidade primeiro.<\/em><\/p>\n

\u2462 Chips de LED vermelho\/amarelo: escassez de mat\u00e9ria-prima \u00edndio, os pre\u00e7os continuam a subir.<\/em><\/p>\n

(2) L\u00e2mpada LED embalada (1515, 2020, 2727, 3535 para exterior):<\/h6>\n

\u2460A disparada dos pre\u00e7os da pasta de prata: os pre\u00e7os da prata subiram acentuadamente ano ap\u00f3s ano, e a pasta de prata representa mais de 301 TP3T dos custos de embalagem.<\/em><\/p>\n

\u2461Aumento anual cont\u00ednuo das l\u00e2mpadas LED SMD padr\u00e3o de 6% para 14%.<\/em><\/p>\n

\u2462LEDs COB com flip chip apresentam capacidade de produ\u00e7\u00e3o limitada e pre\u00e7os premium persistentes.<\/em><\/p>\n

III. PCB e CCL (segunda maior press\u00e3o de custo para m\u00f3dulos)<\/span><\/h6>\n

\u2460Aumento cumulativo de 40% para 55% no acumulado do ano.<\/em><\/p>\n

\u2461Os pre\u00e7os do tecido de fibra de vidro de grau eletr\u00f4nico e da folha de cobre est\u00e3o subindo em conjunto, e as placas de circuito impresso de alta IA continuam a absorver a capacidade de produ\u00e7\u00e3o de folha de cobre fina.<\/em><\/p>\n

\u2462Placas de circuito impresso padr\u00e3o para displays de LED (face simples\/dupla): aumento anual de 18% para 25%.<\/em><\/p>\n

\u2463Os pre\u00e7os de PCBs de alta precis\u00e3o e passo fino, com cobre espesso e requisitos de imped\u00e2ncia, aumentaram em quase 30%.<\/em><\/p>\n

IV. Metais n\u00e3o ferrosos (carca\u00e7as, materiais de soldagem, materiais termicamente condutores)<\/span><\/h6>\n
(1) Cobre (Cobre Eletrol\u00edtico):<\/h6>\n

\u2460Os pre\u00e7os do cobre permanecem em um n\u00edvel elevado, entre 105.000 e 107.000 RMB\/tonelada, um aumento de mais de 301.000 RMB\/tonelada em rela\u00e7\u00e3o ao ano anterior.<\/em><\/p>\n

Impacto: custo da folha de cobre da placa de circuito impresso (PCB), cabos de alimenta\u00e7\u00e3o<\/a>, E os materiais de dissipa\u00e7\u00e3o de calor \u00e0 base de cobre continuam a subir de pre\u00e7o.<\/em><\/p>\n

(2) Lingotes de alum\u00ednio (carca\u00e7a de alum\u00ednio fundido, perfis de alum\u00ednio):<\/h6>\n

\u2460Os pre\u00e7os do alum\u00ednio oscilaram entre 23.000 e 23.800 RMB\/tonelada, um aumento de aproximadamente 181 TP3T em rela\u00e7\u00e3o ao ano anterior.<\/em><\/p>\n

Impacto direto: custos para gabinetes e estruturas de alum\u00ednio fundido de 640 x 480 e 960 x 960, taxas de processamento de gabinetes aumentaram de 5% para 12%.<\/em><\/p>\n

(3) Estanho met\u00e1lico (solda, pasta de solda):<\/h6>\n

\u2460Os pre\u00e7os \u00e0 vista continuam a atingir novos patamares, com ganhos anuais superiores a 40%.<\/em><\/p>\n

Fator de risco: O fornecimento de min\u00e9rio de estanho est\u00e1 se tornando mais restrito; se os pre\u00e7os continuarem a subir, o custo dos consum\u00edveis de soldagem aumentar\u00e1 ainda mais.<\/em><\/p>\n

\"\"<\/p>\n

V. Componentes de fontes de alimenta\u00e7\u00e3o e fontes de alimenta\u00e7\u00e3o chaveadas para LEDs<\/span><\/h6>\n

\u2460 Existe uma diferencia\u00e7\u00e3o significativa entre MOSFETs, circuitos integrados de gerenciamento de energia e capacitores eletrol\u00edticos.<\/em><\/p>\n

\u2461 MOSFETs de controle industrial de alta tens\u00e3o e circuitos integrados de pot\u00eancia de alta qualidade, em falta, pre\u00e7o subindo de 10% para 20% e prazos de entrega estendidos.<\/em><\/p>\n

\u2462 Componentes padr\u00e3o de baixa tens\u00e3o para o consumidor, ampla oferta, aumento de pre\u00e7o limitado.<\/em><\/p>\n

\u2463Fontes de alimenta\u00e7\u00e3o chaveadas para displays de LED finalizados, pre\u00e7o subiu de 7% para 15% em rela\u00e7\u00e3o ao ano anterior.<\/em><\/p>\n

VI. Componentes do sistema de controle:<\/span><\/h6>\n
Nova\/Linsn\/Huidu\/Colorlight:<\/h6>\n

\u2460Os principais chips de controle tamb\u00e9m enfrentam restri\u00e7\u00f5es devido \u00e0 capacidade de produ\u00e7\u00e3o de wafers; o pre\u00e7o das placas receptoras e das placas transmissoras de alta gama aumentou de 8% para 18%.<\/em><\/p>\n

\u2461Os pre\u00e7os de conectores, terminais e cabos planos est\u00e3o subindo constantemente em conjunto com os pre\u00e7os do cobre.<\/em><\/p>\n

VII. Perspectivas gerais para mat\u00e9rias-primas no segundo semestre de 2026:<\/span><\/h6>\n

\u2460Os pre\u00e7os dos circuitos integrados de driver, placas de circuito impresso e chips Mini LED permanecem altos, sendo altamente prov\u00e1vel que ocorram novos aumentos durante a alta temporada, e \u00e9 improv\u00e1vel que haja redu\u00e7\u00f5es significativas.<\/em><\/p>\n

\u2461Flutua\u00e7\u00e3o ampla em n\u00edveis elevados, volatilidade impulsionada por fatores geopol\u00edticos e expectativas de cortes nas taxas de juros no exterior, com baixa probabilidade de uma queda significativa impulsionada por uma tend\u00eancia.<\/em><\/p>\n

\u2462Lumin\u00e1rias LED padr\u00e3o para exteriores, com espa\u00e7amento amplo entre os raios e materiais de baixa qualidade, apresentam uma rela\u00e7\u00e3o oferta-demanda relativamente inst\u00e1vel, com impulso ascendente insuficiente.<\/em><\/p>\n

\u2463 \u00c0 medida que as f\u00e1bricas de wafers continuam a priorizar os chips de computa\u00e7\u00e3o de IA, os prazos de entrega de materiais relacionados a LEDs est\u00e3o se estendendo ainda mais e os pr\u00eamios do mercado \u00e0 vista est\u00e3o aumentando.<\/em><\/p>","protected":false},"excerpt":{"rendered":"

\u4e00.LED driver ICs\uff08the biggest cost pain point this year\uff09 Mainstream manufacturer: ICN\/FM\/SM\/DP \uff081\uff09Price increase: \u2460General purpose constant current ICs\uff08outdoor large LED screens, low end rental market\uff09+15% to 25% year on year. \u2461Common cathode ICs, high refresh rate ICs, and fine pitch specific ICs: cumulative price increase of 25% to 33% in May, ICN officially raised […]<\/p>\n","protected":false},"author":4,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center 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