Why GOB Process Chosen For Fine Pitch Led
1)The core advantages of the GOB process: ①The GOB process involves encapsulating the surface of the led module, after the led chips have been soldered, with a layer of special transparent optical adhesive. ②Significantly enhanced physical protection: the formed colloidal layer effectively provides waterproofing, moisture resistance, dust protection, and impact resistance. ③This allows the screen […]
Why GOB Process Chosen For Fine Pitch Led 続きを読む "

